TSMC

“TSMC Arizona's first fab is scheduled to begin production of N4 process technology in 2024, and TSMC has started construction of a second fab scheduled to begin production of 3nm process technology in 2026; when complete the two fabs will manufacture over 600,000 wafers per year.”

TSMCCEO

Taiwan Semiconductor Manufacturing Company, Arizona investment announcement

The first-fab milestone was met early — high-volume N4 production began in Q4 2024 — but TSMC now targets volume production at the second Arizona fab on N3 for the second half of 2027, so the 2026 leg looks set to miss when the deadline passes.

“TSMC Arizona's second fab will produce 2nm process technology with next-generation nanosheet transistors in addition to the previously announced 3nm technology, with production beginning in 2028; the third fab will produce chips using 2nm or more advanced processes, with production beginning by the end of the decade.”

TSMCCEO

Taiwan Semiconductor Manufacturing Company, CHIPS Act preliminary terms announcement

Construction of the second Arizona fab structure was completed in 2025 with N3 volume production targeted for the second half of 2027, and TSMC broke ground on the third fab (N2/A16) in April 2025.