“Supply of advanced AI chips will not balance with demand until 2025 or 2026 — 'I hope in 2025 or 2026 we can reach the balance' — with CoWoS advanced packaging still the bottleneck.”
Said Jul 18, 2024Deadline Dec 31, 2026TSMC Q2 2024 earnings call, reported by The Register, July 18, 2024
As of mid-2026 supply was still short: reporting citing Taiwan's Economic Daily put the CoWoS demand-capacity gap at roughly 20%, expected to narrow toward 10% by the end of 2026.