CapabilitiesCorrect
“We plan to provide samples of our next-generation 12-layer HBM3E chip to clients in May and begin mass production in the third quarter [of 2024].”
Said May 2, 2024Deadline Sep 30, 2024SK hynix AI-era vision press conference, Icheon (KED Global), May 2, 2024
SK hynix announced on September 26, 2024 that it had begun mass production of the world's first 12-layer, 36GB HBM3E — inside the promised third quarter — after sampling in the spring.