“ASML expects a double-digit EUV lithography spending CAGR between 2025 and 2030 for both advanced Logic and DRAM, as the continued cost-effective scalability of EUV allows customers to further transfer multi-patterning layers to single-patterning EUV 0.33 NA and EUV 0.55 NA.”
Early evidence is supportive: ASML plans to raise low-NA EUV output capacity roughly 30% in 2027 (about 85 systems, from around 65 in 2026).